Assembly of nanosize metallic particles and molecular wires on electrode surfaces

Literature Information

Publication Date 2007-05-29
DOI 10.1039/B703342G
Impact Factor 6.222
Authors

Yoshinori Yamanoi, Hiroshi Nishihara


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Abstract

This article highlights recent developments in the assembly of nanosize materials on electrode surfaces. A brief historical background of the field is given, followed by a selection of topics of particular current interest. We focus especially on the assembly of nanosize metallic particles and molecular wires on gold and silicon electrode surfaces. The fabrication, properties, and characteristics of functional nanostructured biointerfaces on electrode surfaces are also described.

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Chemical Communications

Chemical Communications
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ChemComm publishes urgent research which is of outstanding significance and interest to experts in the field, while also appealing to the journal’s broad chemistry readership. Our communication format is ideally suited to short, urgent studies that are of such importance that they require accelerated publication. Our scope covers all topics in chemistry, and research at the interface of chemistry and other disciplines (such as materials science, nanoscience, physics, engineering and biology) where there is a significant novelty in the chemistry aspects. Major topic areas covered include: Analytical Chemistry Catalysis Chemical Biology and medicinal chemistry Computational Chemistry and Machine Learning Energy and sustainable chemistry Environmental Chemistry Green Chemistry Inorganic Chemistry Materials Chemistry Nanoscience Organic Chemistry Physical Chemistry Polymer Chemistry Supramolecular Chemistry

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