Response of adhesive polymer interfaces to repeated mechanical loading and the spatial variation of diffusion coefficient and stresses in a deforming polymer film

Literature Information

Publication Date 2019-04-29
DOI 10.1039/C9CP00576E
Impact Factor 3.676
Authors

Jeeno Jose, Narasimhan Swaminathan


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Abstract

Comprehensive molecular simulations are conducted to show that polymer crosslinks preserve the strength of solid–polymer (melt) interfaces when they are subjected to repeated mechanical loading. The spatial variation of the diffusion coefficient and local stresses is also investigated along the polymer thickness, during deformation. After each loading cycle, a reduction in entanglement strength is observed at the fracture site. The work of adhesion also decreases over consecutive loading cycles, when fracture is induced at the same site. Reduction in both, the work of adhesion and the entanglement strength, decreases as the crosslink density increases. Diffusion coefficient and stresses vary significantly and in a complex manner along the film thickness during the entire deformation process. These variations were due to peculiar configurations occurring at each instance of separation, which are analyzed and explained in this work. The variation of diffusion coefficient during deformation suggests that other dynamic properties, such as viscosity, also vary spatially during polymer deformation.

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Source Journal

Physical Chemistry Chemical Physics

Physical Chemistry Chemical Physics
CiteScore: 5.5
Self-citation Rate: 10.3%
Articles per Year: 3036

Physical Chemistry Chemical Physics (PCCP) is an international journal co-owned by 19 physical chemistry and physics societies from around the world. This journal publishes original, cutting-edge research in physical chemistry, chemical physics and biophysical chemistry. To be suitable for publication in PCCP, articles must include significant innovation and/or insight into physical chemistry; this is the most important criterion that reviewers and Editors will judge against when evaluating submissions. The journal has a broad scope and welcomes contributions spanning experiment, theory, computation and data science. Topical coverage includes spectroscopy, dynamics, kinetics, statistical mechanics, thermodynamics, electrochemistry, catalysis, surface science, quantum mechanics, quantum computing and machine learning. Interdisciplinary research areas such as polymers and soft matter, materials, nanoscience, energy, surfaces/interfaces, and biophysical chemistry are welcomed if they demonstrate significant innovation and/or insight into physical chemistry. Joined experimental/theoretical studies are particularly appreciated when complementary and based on up-to-date approaches.

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